Deep UV Photoresists
Shin-Etsu is constantly adding to our Photoresist product line; please open the Deep UV Road Map (PDF 115KB) to examine where we are going.
Shin-Etsu MicroSi’s SAIL–G series provides:
High resolution Performance
- 110mm hole; 0.7-0.8um DOF @0.68NA & Ann. Ill
- 120mm hole; 0.3-0.4um DOF @0.68NA & conv. Ill
- 80mm hole; 0.25um DOF @0.85NA & Ann. Ill G28(Dyed) is optimized for thin film process
Etching Resistant
- Etching rate: Same as 248 resist
- After Etch Roughness: Same-Better than 248 resist still smoother with thermal flow
Thermal Flow Available
- 100-90mm hole is achieved, 100mm hole DOF>0.5um @0.68NA
DUV Specialty Applications
Shin-Etsu MicroSi offers thick and thin 248nm excimer DUV resist for specialty applications. These deep UV resists are formulated for super high resolution with very high aspect ratios.
SEPR I051
Shin-Etsu MicroSi’s SEPR I501 DUV resist is formulated for extremely high resolution, straight side wall profiles with printing capability of less than 250 nm isolated trenches and semi-dense lines in 4µm thick film DUV photoresist. This DUV photoresist is widely used in TFH industries for NiFe and Cu substrates.
SEPR I803
Shin-Etsu Microsi’s SEPR I801/I803 DUV resist is formulated for extremely high resolution, with printing capability of less than 65 nm isolated lines and dense lines in 300 nm thin film DUV photoresist. This UV photoresist is widely utilized in Semiconductor and TFH Reader applications that require the highly complex etch resistance property in the deep UV, dry etching environment.
SEPR I382 Fix Slope Angle
Shin-Etsu MicroSi’s SEPR I382 DUV resist is formulated fixed sloped angle resist with extremely high resolution below 200nm trench width. This DUV photoresist is utilized in TFH applications that require the highly complex fix sloped profile for precise micro-electroplating environment.
