Description
Molding Compounds
- Low Internal Stress
- Stable at High Heat & Voltage
- High Thermally Conductive Formulations
KMC-2280H
Shin-Etsu is a leader in developing advanced, semiconductor packaging materials for encapsulating all types of semiconductor devices. This broad line of products is made of silicone molding compounds and epoxy molding compounds that offer low stress, very low warpage, and high thermal conductivity.
Additional information
| Flame Retardant | Green |
|---|---|
| Flexural Strength (N/mm2) | 100 |
| Flexural Modulus (N/mm2) | 13,000 |
| Tg (°C) | 190 |
| CTE 1 (ppm/°C) | 15 |
| CTE 2 (ppm/°C) | 54 |