Description
Shin-Etsu SIPR™-7120 Series is a family of spin-on, chemically amplified positive I-line photoresists formulated to achieve the thick coatings needed for solder bump or copper pillar plating. The SIPR-7120 Series is characterized by low dose requirements, wide process windows at today’s critical dimensions, good plating resistance, and extendability to feature sizes well below current technology.
Properties
- I-line Sensitive (Broadband Tool OK)
- Positive tone
- Chemically-amplified for faster photospeeds
- Capable of 10-100μm in a single coat
- No PEB Required
- TMAH Developable
- Good Plating Resistance
- Easily Stripped