Product Line
CEM
CHALINE®
Exterior
Glass
Interior
MicroPrime
SAIL
Scutum® Photocatalyst
SEPR
SINR
SIPR
SOLBIN®
TC Pad Series
Tersus® Photocatalyst
TIM 1 - Thermal Gel
TIM 1.5 - Two-Part Curable Gap Fillers
TIM 2 - Thermal Grease
Undercoating
VINYBLAN®
VIOSIL-SG1B
VIOSIL-SG1C
VIOSIL-SG2A
VIOSIL-SG2B
VIOSIL-SG2C
VIOSIL-SQ
VIOSIL-SX
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Advanced Packaging Materials (9)
Shin-Etsu manufactures a broad range of photoimageable dielectric materials for advanced packaging applications, wafer-level packaging, and 3D integration. These include photosensitive dielectric materials for redistribution… -
Advanced Specialty Adhesion Promotors (2)
PR1P and PR20P are spin-on-bake adhesion promoters which improves the photoresist adhesion to challenging metal surface such as Copper or gold. PR1P and PR20P reduces… -
Contrast Enhancement Materials [CEM] (2)
CEM (Contrast Enhancement Material) is a photo-bleachable material, water soluble layer which is initially opaque to the exposure wavelength(s), but it becomes nearly transparent (»90%… -
Deep UV Photoresist (1)
Shin-Etsu MicroSi offers thick and thin 248nm excimer DUV resist for specialty applications. These deep UV resists are formulated for either super high resolution or… -
HMDS-Based Adhesion Promotors (3)
Our HMDS and HMDS with DEATS adhesion promoters are used to enhance the bonding of photoresist to a wafer substrate surface. Shin-Etsu MicroSi’s MicroPrime™ adhesion… -
I-Line / G-Line / Broadband Resists (14)
Shin-Etsu MicroSi’s thick film positive DNQ photoresists have been formulated to provide extraordinary lithography results. The properties of these resists include straight vertical profiles, outstanding…