Industries & Applications
Bump Photoresists
Deep UV Photoresists
Encapsulants & Underfills
Flexible
GTO Thyristor Coating
Gel
Hybrid IC Chip Coating
LCD Electride Protection Coating
Photo Diode Coating
Rigid
Thermal Head Coating
LED Encapsulant Materials
Die Bond Material
Encapsulant Material
Reflector Material
TIM
Molding Compounds
Anti-Popcorn
Green Compounds [Anti-Popcorn for Lead-Free Soldering]
Laminates
Lead Frame
Power Devices
Super Low Stress
Photoimageable Dielectrics
Electroplating Resists
Spin-On Dielectrics
Wafer-Bonding Dielectrics
Silicones
Die Bonding
Electrode Encapsulation & Chip Coating
Thermal Interface Materials [TIM]
Double-Sided Tape
Electrically Conductive
High Hardness Thermal Interface Silicone Rubber Pad Materials
Low Hardness Thermal Interface Silicone Rubber Pad Materials
Phase Change Material [PCM]
Product Line
CEM
CHALINE®
Exterior
Glass
Interior
MicroPrime
SAIL
Scutum® Photocatalyst
SEPR
SINR
SIPR
SOLBIN®
TC Pad Series
Tersus® Photocatalyst
TIM 1 - Thermal Gel
TIM 1.5 - Two-Part Curable Gap Fillers
TIM 2 - Thermal Grease
Undercoating
VINYBLAN®
VIOSIL-SG1B
VIOSIL-SG1C
VIOSIL-SG2A
VIOSIL-SG2B
VIOSIL-SG2C
VIOSIL-SQ
VIOSIL-SX
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Thermal Grease X-23-8117
- Packaging & Assembly | Thermal Interface Materials [TIM]
- Shin-Etsu’s X-23-8117 product offering is a thermal interface material developed and manufactured with ease of application in mind. Specifically formulated to include an application chemical…
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Thermal Grease X23-7943
- Packaging & Assembly
- X23-7943 Datasheet Thermal grease, X23-7943, is a Non-Solvent thermal interface material developed and manufactured by Shin-Etsu Chemical Co., Ltd. Shin-Etsu MicroSi’s X23-7943 exceeds thermal management requirements…
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X-23-7772-4
- Packaging & Assembly | Thermal Interface Materials [TIM]
- Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X-23- 7772-4 thermal interface…
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X-23-8039-A/B
- Packaging & Assembly | Thermal Interface Materials [TIM]
- X23-8039 A/B is a two part gap filler. It can be cured with either heat or at room temperature. X23-8039 A/B is a thermal interface…
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X-23-8043-A/B
- Packaging & Assembly | Thermal Interface Materials [TIM]
- X23-80343 A/B is a two part gap filler. It can be cured with either heat or at room temperature. X23-8043A/B is a thermal interface gap…
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X-23-8051-A/B
- Packaging & Assembly | Thermal Interface Materials [TIM]
- X23-80351A/B is a two part gap filler. It can be cured with either heat or at room temperature. X23-8051 A/B is a thermal interface gap…
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X-23-8068-A/B
- Packaging & Assembly | Thermal Interface Materials [TIM]
- X23-8068 A/B is a two part gap filler. It can be cured with either heat or at room temperature. X23-8068 A/B is a thermal interface…
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X-23-8098-A/B
- Packaging & Assembly | Thermal Interface Materials [TIM]
- X23-8098-A/B is a two part gap filler. It can be cured with either heat or at room temperature. X23-8098-A/B is a thermal interface gap filler…
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